IPC-7077 Requirements and Acceptance of Wire Bonding in the Microelectronic Assembly IPC-6013EM Medical Applications Addendum to IPC-6013E Qualification and Performance Specification for Flexible/Rigid-Flexible Printed Boards IPC-6012F Qualification and Performance Specification for Rigid Printed Boards IPC-6012EA Automotive Applications Addendum to IPC-6012E IPC-5262 Design, Critical Process and Acceptance Requirements for Polymeric Applications IPC-4922 Requirements for Sintering Materials for Electronics Assembly IPC-4555 Specification for High Temperature Organic Solderability Preservatives (OSP) coating for Printed Boards
IPC-4202C Flexible Base Dielectrics for Use in Flexible Printed Wiring IPC-2292A Design Standard for Printed Electronics on Flexible Substrates IPC-2228 Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards IPC-2221C Generic Standard on Printed Board Design IPC-1792 Standard for Cybersecurity Management in the Manufacturing Industry Supply Chain IPC-1402 Standard for Green Cleaners Used in Electronics Manufacturing J-STD-004C Requirements for Soldering Fluxes IPC-D-640A Design and Critical Process Requirements for Optical Fiber, Optical Cable and Hybrid Wiring Harness Assemblies IPC-A-640A Acceptance Requirements for Optical Fiber, Optical Cable, and Hybrid Wiring Harness Assemblies IPC-7091A Design and Assembly Process Implementation of 3-D Components IPC-9709A Guidelines for Acoustic Emission Measurement Method During Mechanical Testing IPC-9701B Thermal Cycling Test Method for Fatigue Life Characterization of Surface Mount Attachments IPC-9121A Troubleshooting Printed Board Fabrication Processes
IPC-4592 Requirements for Printed Electronics Functional Dielectric Materials IPC-4412C Specification for Finished Fabric Woven from āāEāā Glass for Printed Boards